Project Logs

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• Layout updates

  Chris Hamilton • 08/31/2015 at 00:13 • 0 comments

  At some point in the future I'll be switching pins again. The i2c was always laid out different from the other Flex Modules. This R 2.0 version will flip the DRV2605 and that allowed me to fix this. I have about 2 dozen R1.0-1.1 LRA Haptic Flex Modules to sell before they are made and I'll keep the documentation referencing them and add the new design info when the R2 are ready.

• Redesigns

  Chris Hamilton • 08/17/2015 at 17:07 • 0 comments

  We just swapped to a 2 layer design. It seems to be very good and we lowered the parts count while making space for the i2c pull-up solder bridge. We might need to redo the pin layout yet again. This still isn't right compared to the other Flex Modules...

• i2c update

  Chris Hamilton • 02/18/2015 at 17:43 • 0 comments

  Swapped VDD/GND to be consistent with other i2c Flex Modules. Also the font on the bottom has been increased to 4, hopefully it looks better. Still working on a panelization solution for this board.

• Update pictures

  Chris Hamilton • 12/18/2014 at 03:01 • 0 comments

  I have mostly discussed this project on the main Flex Modules project log. I just updated pictures with the new board designs. We are still working to optimize silkscreens and the next batch should be even better.

• Testing design

  Chris Hamilton • 09/04/2014 at 06:22 • 0 comments

  I got a pretty good flow with hot air, hand solder paste, and hand flux paste placement on the board.  The boards looked great as far as a tented via just a little bigger than the BGA pad and very centered/circular.  I'll now see if they can speak I2C OK or not.

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