Hi everyone, here is the link to the livestream:
I'll be answering questions live on there ( and typing up summary's here... at the same time lol)
We'll be going live in about a minute here
OK all, let's get started. Let's welcome Mihir from Royal Circuits to talk about quick-turn fabrication. We'll be doing this a little differently as Mihir points out, so you'll want to tune into the livestream now.
We see and hear
Everyone remember that we're asking questions here, and Mihir will respond on the livestream
So ask away...
What is the quickest turn you have ever done?
Whats the smallest order (volume) you will handle?
What drives the decision for a company to demand a quick-turn? Are these prototypes or something?
What's your scale of production? (i.e. What if everyone at DEFCON orders and expects 3 day turn time)
Ah, OK - prototypes mostly
Oh! it's not too late for!
On average how many jobs can you process in a day throughout all your facilities?
Newcomers will want to go to the livestream -
Ahhh bueno pues. Muchas gracias!
That must be a super streamlined supply-chain
Do you guys prefer ODB++ or Gerbers?
Can you guys do box build/final assembly and testing?
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max board layer possible? and does board layer affect turn around time?
I'm thinking of using a Maxim chip which only comes in a wafer scale package, 36 balls at 0.4mm pitch. Any guidance? Or should I avoid that sort of part for a small volume?
For moving towards high density designs, what's a good technology progression with respect to cost? 8mil vias -> 6 layer -> laser vias -> blind / buried -> ???
So you do prototypes - do you make end products for clients? (non prototype). If so - Name a well known product.
I guess, where are the big price jumps
How do laser vias compare with say, 6 mil drills, or jumping to 6 to 8 layers perhaps?
you mentioned paste deposition, would it be possible to add extra paste to accommodate the wicking action of a via in a pad?
Thanks for your answer! Good info.
Thank-you for the answer, answered my question!
Paste printer - so, sort of an inkjet printer for solder paste? How fine can that apply?
Speaking of processing files from a wide variety of PCB tools/programs: do you prefer the paste and soldermask openings on surface mount pads to be 1:1 aspect to the pad, or grown automatically in the gerber files sent to you?
How do you compare/compete with China?
What are the most common reasons that a job might go on hold?
In that same vein of David's question -- what about doing (for example) USB trace impedance? If I don't know your stack up it's pretty time consuming to re-run the traces...
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