IC package epoxy max temperature?
DeepSOIC wrote 04/05/2016 at 09:48 • 1 pointDoes anyone know, what is the maximum temperature that plastic packages of ICs can withstand? Ignoring the die. I tried heating it to 350 deg.C for a few minutes. It smells, but without noticeable degradation.
I have machined a part for 3d printer extruder from an IC package, and I wonder, how long will it last. The extruder goes up to 300 deg.C, and my usual printing temperature is 230 deg.C.
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IC packages use epoxy as the binder. I found this out when an Asian epoxy factory caught on fire about 2010 and world wide news said they produced 80% of ic chips - CPU's skyrocketed in price for 2 years.
In aviation, epoxy parts are understood to with stand 100deg F. more than the potting temperature, and the maximum potting temperature is usually considered to be 200deg F. Therefor 300deg F. (150C) would be the a maximum safe long term working temperature when life safety is concerned. Obviously aircraft do not use a silica mix so who knows what effect this may have. Special High temp epoxy will take 400deg F (200C) see http://www.ebay.com/itm/EPOXY-RESIN-HIGH-TEMPERATURE-4-FIBERGLASSiING-CASTING-BONDING-ELECTRICAL-POTTING-/310403241063
Once again these are for life safety purposes and it seems industrial use would probably work 50-100 C higher - this supports the recommendations of others that have posted comments.
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When it comes to temperature and material degradation, there is not temperature controlled switch to tell "the material is perfectly fine under this temperature" and "now fall apart with loud sound effects". At higher temperature - though the aging effect may not be apparent - material can get softer or more prone to cracks or deformation. It may be visible after minutes or years of usage, depending on many factors. Material aging is alcymy.
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They should at least handle the RoHS reflow temperature of 260C.
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Well, I kind of understand that =) but reflow is only a brief exposure. I would want some hundred hours at that temperature, at least.
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There is a chance that "material declaration sheets", "ROHS/REACH certificates" etc. contain info about the used material, and from there it should be possible to lookup temperatures these materials are stable ( http://www.bourns.com/docs/Product-MDS/dfn-2-package.pdf?sfvrsn=2 , http://www.cypress.com/file/134391/download ). Look out for "mold compound". For Phenol resin (phormaldehyde!), Wikipedia lists "Phenolic resins have no melting point but only a decomposing point in the temperature zone of 220 degree Celsius and above".
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Thanks! That's useful!
So, it says, that IC mold compound is 74% fused silica. That means I probably damaged a drill bit while drilling it. Oops!
Then, it says, epoxy resin 10% and phenol resin 11%. Epoxy resins can be hugely different... Phenol resin, well... probably will decompose and poison me =)
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LOL using IC packages as material for machining, whoda thunk? Why not, huh? Durable, heat-resistant... hmmm....
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