Alias Bob, ready to be sent !

4 Layer PCB ( 1 layer for GND, and another for 3.3V ) :

In theory :

• Correction of MOSFETs errors.
• Adding a reset supervisor to cut the buck and protect battery.
• Improved routing and planes.
• Improved Footprints and mask ( IMU, Buck Boost, USB, Microcontroller).
• Removal of unused I2C pins.
  

I know that I not really follow all High Speed USB design Guidelines, but I think I'll still keep this for now, because :

1. Traces and planes are better than on my previous PCB. And it worked.
2. USB DFU is 12mbit/s and i don't need to use USB CDC ACM at his max speed.
   
3. In case of problems with USB Signal Integrity, I have some good musicians Idea that starts with the letter C for the next PCB. :-)
4. And Finally, libopencm3 Ninjas confirm what I thought !

You can look at the Rastello 0.1 alias Bob schematic.