The purpose of this project is to build a USB Type-C breakout board to facilitate the evaluation of boards designed to utilize the super speed differential pairs. This is intended to be a cost effective alternative to the commercial breakout boards. To keep this accessible to makers, I am designing this to be fabricated at OSHPARK to see what performance I can get with there standard 4 layer stackup. I'm designing the board to be as small as possible to keep the price down and the traces short. It should be a little easier to keep the traces short and matched now that vertical plugs are available ( https://www.digikey.com/product-detail/en/jae-electronics/DX07VN24WA2C1568/670-3103-ND/9695489 ) I don't have access to 3D field solvers, nor the time or patience to use them, so I will take be using my best engineering judgement, over-design a little and use every rule of thumb I can find.