Thank you to JLCPCB for the manufacturing of the PCB

  1. Remove components on a single-side printed circuit board: toothbrush method, screen method, needle method, tin suction device, pneumatic suction gun, and other methods can be used. Most of the simple methods of disassembly of electronic components are only suitable for single-side boards, which has a poor effect on double panel and multi-layer board.

 2. Remove components on double-sided printed circuit board : single side integral heating method, needle holing method, and the soldering machine can be used.

The single integral heating method needs special heating tools, which are not suitable for general use. Empty syringes method: first of all the components that need to be removed, cut the pin, remove the components, then is left on the printed circuit board components by a shear pin, and then use soldering iron melt in on each pin, removed with forceps, until you get all of the pins, then with the solder hole diameter phase optimal medical needles his empty, this method is a few more working procedure, but no effect on printed circuit boards, conveniently and the operation is simple, implementation is very easy, I think after years of practice is an ideal method.

  1. Disassemble components on multi-layer [Printed circuit board](Printed circuit board): If the above methods are used (except soldering machine), it is either difficult to disassemble or easy to cause faults between layers. Generally, the method of welded pipe foot is adapted to cut the root of the components and leave the pin on the printed circuit board. Then, the pin of the new device is welded to the pin on the printed circuit board. But it is not easy to weld the multi-pin integrals. Soldering machine (also known as secondary soldering machine) can solve this problem and is the most advanced tool for disassembly of integrated blocks on double and multi-layer printed circuit boards, but the cost is high.

Tin flow welding machine is actually a kind of special small wave welding machine, is to use tin flow pump from the tin-pot of fresh and has not been oxidized molten tin, the optional spray tin mouth poured out of different specification, form a local small wave, effect on the bottom of the printed circuit board, components of pins on the road of printing plate were removed with the solder welding in 1 ~ 2 seconds will melt immediately, at this point, can light the days to set aside the components, and then use compressed air to blow component parts of the hole, insert a new element, and the mouth of the tin on the wave crest welding products.

The following content will show steps for how to remove components from PCB board

The tools are: hot air gun and pliers

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Part to be Removed :(16-pin IC in the figure)

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Clamp both ends of IC with pliers

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Turn on the hot air gun, set the temperature to 380 degrees and the wind to 80% position, and rotate the IC foot on the back of PCB to evenly heat it!

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Heat evenly as shown in the figure above. After heating for 10 seconds, quickly pull out the pliers, the IC will be removed perfectly!

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