• F300

    Michael Schembri • 04/10/2025 at 09:45 • 2 comments

    Increased feed to 300. And modified pads to be thinner and tuned Cu2Cu seperation.

    Good: 

    Interpad routing ok. SMD are now distinct.

    PCB transfer in less than 20 minutes.

    Bad: Still some tracks joining - I think this is because of uneven toner layer. Will research some different application methods.

  • F200

    Michael Schembri • 04/03/2025 at 21:01 • 0 comments

    F200 feed: Tracks are now more distinct. However, we still have problems passing a track between 2 pads 100mil apart. 

    Still need to see how I can remove double pass output of Flatcam.

    To check reducing horizontal size of pads.

  • F100 Feed

    Michael Schembri • 04/02/2025 at 16:33 • 0 comments

    Redone using F100 feed. However, still too much heat is transferring, getting tracks a bit wider than beam incident point.

  • Improvements

    Michael Schembri • 03/31/2025 at 10:33 • 0 comments

    1. Applying toner method using spray method or maybe immersion method (help needed)

    2. Use faster settings in the grbl during laser firing. F30 is slow and heat might be propagating outside of point of incidence. Therefore more toner is melting than required.

    3. Change flatcam to fire tracks only once. Isolation tracing fires each track segment twice.

    4. Reduce pad/via size

    5. Once visually acceptable, one can also try to etch this.