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Low melt solder connected robots

Using resistors as heat sources to reflow solder is a lightweight electrical+mechanical connection for modular robots, with no problems

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I've been working on modular robots to build load-bearing modular structures. To that end, I've needed a lightweight joining system for robot modules that can ideally form an electrical and mechanical connection at the same time. The goal of this is to enable a modular robot to assemble other modular robots... that in turn assemble more robots, and on and on, a future everyone is excited for and wants. After ~surveying the literature~, I decided to adapt Jonas Neubert and Hod Lipson's joint system from the Soldercubes modular robotics project (https://jonasneubert.com/publications/soldercubes-selfsoldering-modular-robot-system-jonas-neubert.pdf). They developed a system based around melting low-melt solder using large surface mount resistors, which is a great, cheap, and lightweight way of essentially gluing modules together. This project essentially adapts this principle to a lattice-based geometric framework. (And explores some more stable configurations for more robots).

Basically, the idea here is to use FR4 PCBs as a structural component for a 3D lattice modular block and to connect them together with reflowed low-melt solder controlled by a MOSFET that just dumps a bunch of current through some chunky SMD resistors. This is intended to enable self-assembling modular robots. Here's a video for a conference paper on that for reference: 

First, some background.

The goal of this work is to create a modular robot that can assemble modular structures/other modular robots. So, the idea is to have a geometrically compatible library of electronic blocks ("functional voxels") as well as purely mechanical ones ("mechanical voxels"). I won't really go into detail here, but you can check out the paper we wrote about this here.  

Based on this overall goal, we can identify a few target specs to hit:

  • Simultaneous mechanical + electrical connection for functional voxels
  • Lightweight -- b/c robot needs to support its own weight in really unfavorable loading conditions, it's really important to keep this as lightweight as possible
  • Cheap -- b/c we theoretically want a huge amount of these, and b/c most of the work I did on this project was while it wasn't attached to a specific grant, :p the mechanism needs to be cheap
  • Reversible (we can undo it and redo it at least a handful of times without meaningful performance difference)
  • Low effort to assemble lol 

The system.

Based on these requirements, I looked through the literature on modular robots and identified the system used in Soldercubes as hitting most of these requirements, with the exception of low effort— they used a Field's alloy system that required a bunch of priming steps... I assumed low melt solder had advanced since then, and it has: Chipquik's line of Indium-based low temperature solders is easy to use and is offered at a range of temperatures that an SMD resistor should probably survive.

I also decided a directional joint, i.e. an actively heated board connects to a passively heated board and so on, would be lower effort to implement. This additionally forces a specific assembly sequence, which while it can have its drawbacks, practically tends make life easier. Because we're assuming an assembly direction from the get-go, this simplifies all of the connector layouts. 

The overall system layout is: each robot/system has one primary microcontroller (ESP32-WROOM) that we can talk to over Wi-Fi from a central laptop that does all the path planning etc. This is networked to all the functional voxels/modules over an I2C bus. These periphery modules can provide a variety of functions, but in general they are all ATtiny412 based and contain one PWM enabled output and one analog input for free play, the I2C bus connections, and the resistive heating circuit. These receive regulated 5V power from an onboard linear voltage regulator, while the heating circuit (or any other output devices, e.g. hobby servos) receive the power rail voltage. 

So, based on that, we transmit 4 lines between each voxel face: V_batt, ground, SDA, and SCL. For back-to-back connections, i.e. from block-to-block or between voxels, this is handled using the resistive heating circuit. For connections within a voxel or module, this is done using a soldered corner joint or using wiring. 

Implementation. 

I used a 65 mm lattice pitch (the bounding box around the module is 65 mm side length). The PCBs are two layer boards from JLCPCB, with the routing as described above. B) Shows a passive face, where the four connection points are the spots on the middle of the beams. C) shows an active ATTiny412 based face, where the SMD resistors are visible. The empty holes at the corners are used for magnets, which help with fine alignment between the modules before the solder is reflowed. By adding actuation, we then get robot modules. F) is a gripper module for picking up/walking over existing blocks, while G) and H)...

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ant_servo_1 v6.obj

OBJ files of the lighter weight joint

obj - 2.63 MB - 11/10/2025 at 16:54

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robot_modules.f3z

CAD for the main module types, including gripper, elbow, and wrist actuators. It's not so cleanly organized haha rip sry.

f3z - 7.56 MB - 11/10/2025 at 16:53

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attiny412_v1_2023-01-28.zip

gerbers for the ATtiny412 boards

Zip Archive - 95.33 kB - 11/10/2025 at 16:51

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esp32_v1_2023-01-30.zip

gerbers for the ESP32 primary controller

Zip Archive - 127.19 kB - 11/10/2025 at 16:51

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PCB_v1_general_2023-01-30.zip

gerbers for the plain functional voxel face

Zip Archive - 33.56 kB - 11/10/2025 at 16:51

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  • 1 × ATtiny412
  • 4 × 2010 SMD Resistors, 0.25 Ohms
  • 1 × 5V linear voltage regulator, 100mA, sot23-3
  • 1 × LED 1206
  • 1 × N-Ch mosfet 30V 5.2A sot23-3

View all 9 components

  • 1
    Disclaimer

    I'm not sure that I would recommend literally implementing this with the files attached lol. I would make 2 changes regardless of the application: slightly increasing the connection pad size, and slightly increasing the voxel corner joint footprints. Nice-to-haves might be a version with real Pogos added for better temporary stability. 

  • 2
    Stuff the PCBs, print your parts

    I like a manual solder paste-based workflow haha. These boards are all designed with 1206 components, so it's not too painful at all. 

    For the printed parts, you want to be cognizant of how close you are to the low-melt solder reflow pads. If you give enough air gap (3mm or so), I haven't had any problems with PLA. You can get much closer (or even touching) with something like PC, but in general the resistors will get hotter than the softening temp, so watch out. 

  • 3
    Pre-apply low melt solder

    This is a dumb set up, but to ensure even-ish solder quantities, I pre-chop the wire solder into equal lengths and then pre-tin the pads. This is also where I'd stick the thin gauge wire into a via on each pad to form a single use bad and ugly spring-loaded element to ensure immediate electrical connectivity to the new module.

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Discussions

Gravis wrote 6 days ago point

While the specific implementation seems a bit too flimsy, the basis of this is amazing! I love to see a more assembly line type construction method where several arms work to construct a new one. PCBs aren't a great construction material for mechanical matters but they certainly are cheap. I think it would be interesting to see an implementation that also made the PCBs but not a normal flat FR4 PCB but some material and/or shape that is stronger. This concept has serious merit as there is an obscene amount of "waste" plastic and e-waste that could be used for to construct self-replicating robots (to process even more plastic and e-waste).

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miana wrote 5 days ago point

Yeah! - something I have been super excited about is trying to make our own PCB substrates so we can use custom materials and maybe better leverage sheet metal-forming techniques. We worked on a version similar ish to this system using aluminum substrate PCBs, which are equally cheap but with more reliable+performant mechanical properties, but b/c of the thermal dissipation + surprisingly large cost increase to go to 2-layer, we didn't implement the solder based connector for that version. 

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