The prototypes pictured in the first project photo were displayed at MakerFaire Detroit, with positive comments. All three prototypes were assembled by hand-soldering with an iron. The SOIC-8 footprint was too narrow for the selected chip. Care must be taken to avoid soldering to the cap of the crystal. The next revision will have larger pads for the crystal to help mitigate this. The cathode marks on D2 and D3 are difficult to see, so should be made more visible (they are in the same orientation as D1 and D4). U2 is definitely easier to solder if populated before C1. As with all plastic switches, care must be taken to solder S1 without melting the plastic components. D5 (which is current limited by R3) is too bright, and can make discrete use of the device difficult.