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DRV2605L LRA Driver Flex Module

DRV2605L based (linear resonant actuator)LRA driver with i2c control, haptic library, audio input, and motor sized. For sale on Tindie.

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We need an I2C controlled LRA driver. With the new DRV2605L, we are able to produce small batches with great yield using OSHPark boards. We will be making larger batches soon as they are selling quite well.

This board is part of Fyber Labs Flex Module project.

This board provides LRA/ERM vibration motor drive control through i2c. There is Arduino code available from Precision Microdrives.

We original worked with the DRV2605 which was only available in BGA. This limited our yield and was costly to work with. TI has now introduced a new version in TSSOP as the DRV2605L. We are selling these on Tindie right now. We also sell a wide range of ERM and LRA motors including new low cost Samsung LRAs.

Any software related will be released under BSD or MIT license. SAAS or cloud based software will be AGPL.

Creative Commons License

  • 1 × DRV2505L Haptic Driver for ERM and LRA with Built-In Library and Smart Loop Architecture

  • Layout updates

    Chris Hamilton08/31/2015 at 00:13 0 comments

    At some point in the future I'll be switching pins again. The i2c was always laid out different from the other Flex Modules. This R 2.0 version will flip the DRV2605 and that allowed me to fix this. I have about 2 dozen R1.0-1.1 LRA Haptic Flex Modules to sell before they are made and I'll keep the documentation referencing them and add the new design info when the R2 are ready.

  • Redesigns

    Chris Hamilton08/17/2015 at 17:07 0 comments

    We just swapped to a 2 layer design. It seems to be very good and we lowered the parts count while making space for the i2c pull-up solder bridge. We might need to redo the pin layout yet again. This still isn't right compared to the other Flex Modules...

  • i2c update

    Chris Hamilton02/18/2015 at 17:43 0 comments

    Swapped VDD/GND to be consistent with other i2c Flex Modules. Also the font on the bottom has been increased to 4, hopefully it looks better. Still working on a panelization solution for this board.

  • Update pictures

    Chris Hamilton12/18/2014 at 03:01 0 comments

    I have mostly discussed this project on the main Flex Modules project log. I just updated pictures with the new board designs. We are still working to optimize silkscreens and the next batch should be even better.

  • Testing design

    Chris Hamilton09/04/2014 at 06:22 0 comments

    I got a pretty good flow with hot air, hand solder paste, and hand flux paste placement on the board.  The boards looked great as far as a tented via just a little bigger than the BGA pad and very centered/circular.  I'll now see if they can speak I2C OK or not.

View all 5 project logs

  • 1
    Step 1

    Detailed discussion of tools and process will be made on the Flex Module project.

  • 2
    Step 2

    Order board from OSHPark and solder paste stencil through OSH Stencils.

  • 3
    Step 3

    Order BOM components.

View all 5 instructions

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