Dear Nicola.  For temperature uniformity please refer to Figure 15 of the original post.  It is within just a few degrees over an area of approximately 100 x 250 mm.  The maximum ramp up rate depends on the target board characteristics and the desired final temperature.  It is about 2.6°C/s to 300°C (see Figure 41).  The maximum oven cavity temperature is set by a thermal fuse to prevent the wiring and plastic handles and fittings on the oven from melting.  Board temperatures (which are primarily governed by radiant as opposed to convective heating) can be over 350°C.  The current controller reproduces both lead and lead-free solder profiles perfectly.

Hi! Did you measure the uniformity of the temperature? What is the maximum temperature? It would be nice if it arrived at 255-260°C for RoHS soldering. And what is the ramp rate?