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FlexSEA-Manage

A project log for FlexSEA: Wearable robotics toolkit

OSHW+OSS to enable the next generation of powered prosthetic limbs and exoskeletons. Let’s make humans faster/better/stronger!

Jean-François DuvalJean-François Duval 05/12/2015 at 17:450 Comments

FlexSEA-Manage is a polyvalent circuit that can have a wide range of usages depending on the system architecture. In the simplest system designs, it will act as a communication protocol translator, allowing Plan and Execute to communicate. When multiple FlexSEA-Execute are used, it routes packets, and can manage communication timings. It can be used to add extra sensors and output devices to the system. In systems that do not require the computing power of an embedded computer, Manage can host the high-level state machines.

The following figure presents the hardware diagram of FlexSEA-Manage 0.1. In orange are the schematic sheets and in grey are the sub-circuits present on certain sheets.

Electrical specifications

Supply voltage (V)

5V in (from Plan or USB), on-board 3V3 regulator

Current (mA)

90mA

Microcontroller

Reference

STM32F427ZIT6

Special features

Floating-point co-processor can be software enabled.

CPU/RAM/IOs/Package

180MHz ARM Cortex-M4, 2MB FLASH, USB

Software / IDE

Eclipse C/C++, GNU Tools for ARM Embedded Processors (arm-none-eabi-gcc), OpenOCD GDB.

Serial interfaces

Type

2x [half-duplex, asynchronous full-duplex or synchronous full-duplex RS-485]

Bandwidth

2-10Mbps

Type

Full-duplex SPI

Bandwidth

20+ Mbps

Onboard USB

Full-Speed (FS) / High-Speed (HS)

Peripherals / features

FLASH memory

128Mbits

IMU

6-axis (3x accelerometer, 3x gyroscope)

Power output

2x 24V 1A high-side switches

LEDs

2x green, 1x RGB

Switches

1x user input switch

IO connector

Molex PicoClasp 40 positions, SMD 1mm pitch

External peripherals

IOs available

17, shared with functions below

Digital IOs

Up to 9, protected

Analog inputs

8x 12-bit SAR with special functions (filters, amplifiers, dividers, …)

Serial

I²C, SPI, USART

Dimensions (mm)

X (mm)

40

Y (mm)

40

Z (mm)

11.5

PCB technology

Layers

4

Copper

1Oz

Trace/space/via

5/5 mils trace/space, 8/20 mils vias

Technology

Standard

Assembly

Double-sided

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