The newest SMT ICs are becoming really small and powerful. The small size means opperating without a heatsink can be risky.
These new SMT ICs feature an exposed metal pad for heat output. The pad is located on the under-side. Commonly the metal pad is soldered to copper layers in the PCB for cooling. The PCB acts as a heat spreader. This technique is limited in power handling, and presents many design challenges.
PowerPeg is a two-part system for attachment of high-performance heatsinks to even the smallest ICs. First the thermal connector solders to the PCB & IC. Later the heatsink bolts-on.
Electronics are higher performing, longer lasting, and more energy efficient when properly cooled.
The goal of this project is to bring PowerPeg to mainstream electronics design, and provide off-the-shelf cooling accessories.