Soldering

Assembling the board proved to be the most difficult step. Hand soldering that damn ground pad under the ESP8266 never worked as expected because of the heat dissipation. Managed to get two chips soldered correctly by heating the chip to around 350 degrees C with the soldering tip, abusing them thermally. Bad practice, but they seem to be fully functional.

Tried also with hot air, but it had fried my board before it would solder anything. I even simulated poorly a reflow oven temperature curve, but I couldn't get the board evenly heated on both sides so it didn't work.

Fortunately, I did manage to get access to the university's reflow oven, which in Romania is harder than it seems. Then, blamed myself for not getting a stencil.