If you look closely at the module in the picture you can see that 4 resistors on the top left of the module are missing, on the other modules I have they are not missing! So I must've blown them off with all my hot air. There's also a bit of toombstoning on the RF capacitor and 0Ohm resistor which wasnt good.

So I tried again, This time I didn't tin the pads for the module, Just a massive puddle of flux. I tacked a few pads in one corner with a blob of solder while pressing the module in place. I then started dragging solder around the module and surprisingly few of them bridged! It was like magic! The ones that did bridge cleaned up nicely with a freshly tinned tip. The GND pads were the trickiest, assumingly due to being more heatsinky and I was very careful not to bridge onto the passives on the module itself, which are quite close to the edge.

I made sure to get the RF resistor and capacitor nice and flat and I'm really happy with the results. I've probably only soldered 200 components and I'm sold on 0603 now, so much quicker and less hassle that through-hole!

I'm certainly going to build a reflow oven at some point though because so many interesting parts are in BGA or QFN.

This one picks up lots more neighbouring APs than the first one :D