I am sure that anyone with experience my have several questions as to why I have done some of the things that I have done in my board designs, and the answer to that is simply because I am making it up as I go along. Those details will hopefully work themselves out with time, but right now I have two questions with the copper pour on my most recent board v1r4. The first would be about the top left set of vias for pin 8 through AREF. Along the wire for the grounding pins there is a blob. Is it better to leave that blob or would it be better to keep those vias connected by a wire that is not named "GND"?
The second question is about a portion of the board that is separated from the copper pour. Is it better to continue the pour over this area by using vias, or is it better to leave it without the copper? My concern is a ground loop, but I am hoping that someone with more insight may be able to answers these questions.