All my exposed silicon were without wire bonds. Wire bond is this thin wire that connects IC to the package. And the question is have I removed them accidentally when cleaning and removing package or it was blown by the high voltage of Tesla coil. To check it I took fine wire I have of 0.0005inch which is 0.0127mm. And put it near by Tesla coil output. You can see it start to glow at distance of about one centimeter. 

And those are a bad news since this means I cannot use plasma to open IC's encapsulation without damaging bond wites, thus leaving IC unfunctional. 

But, another test shows that while putting wire near tesla coil is bad putting it near the flame is fine.

Although more tests are needed to find which distance is minimal. The fact that plasma flame doesn't burn bonding wires is excellent news, now we can hope to extract ICs intact.