According to this page:
in 2018 MOSIS will collect C5F/C5N 0.5um designs on these dates:
- April 2nd
- August 6th
- December 3rd
So we can choose April 2nd, 2018 as possible next "tapeout" date for our 2nd chip - anybody interested? ;)
Maximal possible size of the die for minimal cost is 4 mm^2 now (it could be square 2x2 mm or 2000x2000 um) and we will order minimal possible quantity - 40. Planned packaging was DIP40, so die may have 40 pads on it (10 pads on each side of the die). Our old pad generator will not work, because last time die had slightly bigger size - 2.2x2.2mm (to meet 5mm^2 limit at that time).
Technically possible to put more pads - if we will keep the same sizes and spacing as last time (100x100um pads with 50um between each other and 25um from pads to border - actually it was recommended size by MOSIS) then we can put N*150 on each side and for 2000um it will be N=13, so it's 13+13+11+11=48 max and now, surprise-surprise, DIP48 is also available as an option for packaging (even though slightly more expensive)!
Now I plan to have everything OPEN SOURCE and fully available on every stage of the work under PUBLIC DOMAIN :)