Core Module Interface Assembled:

Just a sneak peek at some of the assembled boards of our project. Certainly having a SMD part stencil came in very handy adding the quite small QFN components. 

SMD Part Stencil:

While I have placed QFN packages before with success for small batch prototypes there is always the chance of placing an expensive IC incorrectly will resulting in costly reworking. For certain elements of this project I have made Part stencils to help with tricky parts and parts that require aligning. Making a Part stencil is very simple and can be done in a few ways from using a 3D Printer to a laser cutter. For me using my resin printer which the best option has a can achieve a very respectable 0.05mm tolerance. Once you know what parts you would like help placing its just 4 easy steps for accurate and repeatable placement. Of course these can be lost if have access to a PnP machine but it's certainly a good start. 

Bare Board PCB Arrivals:

1. High-P Core.
2. Core Interface.
3. Adaptive Interface Module.

These certainly arrived sooner than I planned and but a nice surprise.

The parts are on order and will be fully assembled shortly.