Layout Considerations

  1. 4-layer PCB stackup: signal/ref(0V)/ref(0V)/signal
  2. place analog and digital parts as far as possible apart from each other, to reduce cap./induc. coupling
  3. local decoupling at each power pin of each IC + vias to reference planes near the power lines
    provide a defined return path!
  4. use dedicated ground traces from charge pump inverter pins to decouping caps --> reduce coupling into plane
  5. no reference plane under crystal

Schematic/Layout Concerns - Low Noise (rework in progress)

Rev1:

For now I have chosen the LT1028 as op-amp, as this part was suggested by the DAC's datasheet (PCM1794A) due to is ultra low noise performance.

LT1028: input noise voltage density at 1kHz of 1.2 nV/rtHz max, but this comes at the price of ~10€/part. So this raises the question, if any switching noise of the digital part etc. would be much higher than this.

Alternative part used by "Project-1": OPA2134 (8nV/rtHz @ 1kHz), its half the price

Rev2:

Stability Issues with Rev2 Amp. Circuit (work in progess) 
On hold for now due to a lack of time. Although, the Rev2 amp may not work as intended.

USB Inrush current limitation

USB 2.0 limits the VBUS capacitance to 10uF

Layout Concerns -  USB  (resolved)

Plan on getting the first PCBs manufactured by OSH Park, but need to validate the layout first.

Since a USB-C connector is a must for this project (future-proof connector), I may get some issues with how I connected the two instances of D+/D-.

Did some TL impedance calculations for the USB lines based on the micro strip approx. given by Pozar (Microwave Engineering) for a single ended (45 ohm) line, see the matlab script. Checked the line width for a differential pair (90 ohm) with this calculator: https://www.eeweb.com/tools/edge-coupled-microstrip-impedance/
So the traces on the current layout should meet the 90 diff. impedance requirement. However, the traces are thinner at the beginning, as the connector has a lower pitch.

I assumed a rise time (USB) of 8 ns, did some measurements with a USB 2.0 FTDI Serial bridge and my DS1054Z (hacked). So I'm not sure if this scope is suitable for this kind of measurements.  With this assumption, the line lengths (propagation delay) should be low enough to assume lumped elements (tcrit = trise/4, tdelay < tcrit), see matlab script as well.

Further, I assumed the thinner traces (10mil) at the connector, as some additional TLs (matlab script) and calculated a potential impedance, which might match the line in this situtation.

Feedback from r/PrintedCircuitBoard: USB chip is too slow to cause issues here --> any additional matching is not required.

Part Selection

Footprints

Rev1:

Rev2:

Enclosure

PCB dimensions where chosen for a "miniature aluminium casing" from fischer elektronik.

https://www.fischerelektronik.com/web_fischer/en_GB/cases/M1.07/Miniature%20aluminium%20casing/VA/AKG412050ME/index.xhtml

PCB dimensions: 50mm x 37.3mm, 4mm indent on both sides as the screw holes limit the height at the edges

The case has slots on each side, which fit a 1.6mm thick PCB.

Feedback from r/PrintedCircuitBoard

https://www.reddit.com/r/PrintedCircuitBoard/comments/lcez8t/schematicpcb_review_usb_audio_dac/

Rev1 Kicad files:

https://www.dropbox.com/sh/fwv7mbl27t8j60g/AABG_s2a8BGu0kFvHlPDWCuma?dl=0