Today, I received the last shipment of components. Naturally, I am quite excited to play with the MCU and the radio chip. The fun starts already with the assembly: although I have soldered an MSOP10 package (like the Si4012) before, it will be my first time soldering a TQFP48 package (the size the EFM32ZG222 came in). I ordered most of the passives in 0805 packages, which I have dealt with successfully before. However, the space restrictions on the PCB might require some planning on my part to make sure the components I want to solder are somewhat accessible.